EP3038148
WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD
Status:
EP einkaleyfi: Þýðing ekki lögð innEP appl. date:
21.12.2015EP published:
2.8.2017EP application number:
15201534.3
EPO information:
European Patent Register
Max expiry date:
20.12.2035
Title:
WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD
Timeline
Today
21.12.2015EP application
2.8.2017EP Publication
Owner
Name:
Shin-Etsu Chemical Co., Ltd.Address:
6-1, Ohtemachi 2-chome Chiyoda-ku, Tokyo, JP
Inventor
Name:
YASUDA, HiroyukiAddress:
Annaka-shi, Gunma, JP
Name:
SUGO, MichihiroAddress:
Annaka-shi, Gunma, JP
Name:
TAGAMI, ShoheiAddress:
Annaka-shi, Gunma, JP
Name:
TANABE, MasahitoAddress:
Annaka-shi, Gunma, JP
Priority
Number:
2014259813Date:
24.12.2014Country:
JP
Classification
Categories:
H01L 21/683, C09J 7/02, B24B 37/30