EP3321025
LEAD-FREE SOLDER ALLOY, FLUX COMPOSITION, SOLDER PASTE COMPOSITION, ELECTRONIC CIRCUIT BOARD AND ELECTRONIC CONTROL DEVICE
Status:
EP einkaleyfi: Þýðing ekki lögð innEP appl. date:
21.3.2017EP published:
25.11.2020EP application number:
17770236.2
EPO information:
European Patent Register
Max expiry date:
20.3.2037
Title:
LEAD-FREE SOLDER ALLOY, FLUX COMPOSITION, SOLDER PASTE COMPOSITION, ELECTRONIC CIRCUIT BOARD AND ELECTRONIC CONTROL DEVICE
Timeline
Today
21.3.2017EP application
25.11.2020EP Publication
Owner
Name:
Tamura CorporationAddress:
1-19-43 Higashi-Oizumi Nerima-ku, Tokyo 178-8511, JP
Inventor
Name:
ARAI MasayaAddress:
Iruma-shi Saitama 358-0032, JP
Name:
NAKANO TakeshiAddress:
Iruma-shi Saitama 358-0032, JP
Name:
HORI AtsushiAddress:
Iruma-shi Saitama 358-0032, JP
Name:
KATSUYAMA TsukasaAddress:
Iruma-shi Saitama 358-0032, JP
Name:
MUNEKAWA YurikaAddress:
Iruma-shi Saitama 358-0032, JP
Name:
MARUYAMA DaisukeAddress:
Iruma-shi Saitama 358-0032, JP
Priority
Number:
2016057712Date:
22.3.2016Country:
JP
Number:
2016182809Date:
20.9.2016Country:
JP
Number:
2016224592Date:
17.11.2016Country:
JP
Number:
2017015245Date:
31.1.2017Country:
JP
Classification
Categories:
B23K 35/26, B23K 35/02, C22C 13/00, C22C 13/02, B23K 35/36, H05K 3/34, H01L 23/00